Intel T1700 Manual de Usario
Intel
Procesador
T1700
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Intel® Celeron® Mobile Processor
Dual-Core on 45-nm Process
Datasheet
For Platforms Based on Mobile Intel® 4 Series Express Chipset Family
September 2009
Document Number: 321111-003

2 Datasheet
Legal Lines and Disclaimers
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TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics
of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with
this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check
with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
Enhanced Intel SpeedStep® Technology for specified units of this processor is available. See the Processor Spec Finder at http://
processorfinder.intel.com or contact your Intel representative for more information.
Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM) and, for some
uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations
and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.
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enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS.
Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.
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Copyright © 2008, Intel Corporation. All rights reserved.

Datasheet 3
Contents
1 Introduction ..............................................................................................................7
1.1 Terminology .......................................................................................................8
1.2 References .........................................................................................................9
2 Low Power Features ................................................................................................ 11
2.1 Clock Control and Low Power States .................................................................... 11
2.1.1 Core Low-Power States ........................................................................... 12
2.1.2 Package Low-Power States ...................................................................... 13
2.2 Low-Power FSB Features .................................................................................... 15
2.3 Processor Power Status Indicator (PSI#) Signal..................................................... 15
3 Electrical Specifications ........................................................................................... 17
3.1 Power and Ground Pins ...................................................................................... 17
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 17
3.3 Voltage Identification......................................................................................... 17
3.4 Catastrophic Thermal Protection .......................................................................... 20
3.5 Reserved and Unused Pins.................................................................................. 20
3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................ 21
3.7 FSB Signal Groups............................................................................................. 21
3.8 CMOS Signals ................................................................................................... 23
3.9 Maximum Ratings.............................................................................................. 23
3.10 Processor DC Specifications ................................................................................ 24
4 Package Mechanical Specifications and Pin Information .......................................... 29
4.1 Package Mechanical Specifications ....................................................................... 29
4.2 Processor Pinout and Pin List .............................................................................. 33
4.3 Alphabetical Signals Reference ............................................................................ 53
5 Thermal Specifications and Design Considerations .................................................. 61
5.1 Monitoring Die Temperature ............................................................................... 61
5.1.1 Thermal Diode ....................................................................................... 62
5.1.2 Thermal Diode Offset .............................................................................. 64
5.1.3 Intel® Thermal Monitor........................................................................... 65
5.1.4 Digital Thermal Sensor............................................................................ 66
5.1.5 Out of Specification Detection .................................................................. 67
5.1.6 PROCHOT# Signal Pin ............................................................................. 67
Especificaciones del producto
Marca: | Intel |
Categoría: | Procesador |
Modelo: | T1700 |
Color del producto: | Black, Stainless steel |
Peso.: | 4800 g |
Ancho: | 235 mm |
Profundidad: | 168 mm |
Altura: | 543 mm |
Fuente de alimentación: | 220 - 240 V |
Activos: | 150 W |
Contenido contenedor/lata: | 1 l |
Interruptor encendido / apagado: | Ja |
Piezas aptas para lavavajillas: | Ja |
Pies antideslizantes: | Ja |
contenedor de savia: | Ja |
Velocidad de rotación: | 60 RPM |
Frecuencia-de-entrada-de-CA: | 50 - 60 Hz |
Tipo-producto: | Slowjuicer |
Comedero de frutas extra grande: | 75 mm |
barredora de pulpa: | Ja |
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