Microchip ATECC608B-TCSM Manual de Usario

Microchip No categorizado ATECC608B-TCSM

Lee a continuación 📖 el manual en español para Microchip ATECC608B-TCSM (28 páginas) en la categoría No categorizado. Esta guía fue útil para 8 personas y fue valorada con 4.5 estrellas en promedio por 2 usuarios

Descargar PDF

Página 1/28

ATECC608B

CryptoAuthentication™ Device Summary Data Sheet

Features

• Cryptographic Co-Processor with Secure Hardware-Based Key Storage:

– Protected storage for up to 16 keys, certificates or data

• Hardware Support for Asymmetric Sign, Verify, Key Agreement:

– ECDSA: FIPS186-3 Elliptic Curve Digital Signature

– ECDH: FIPS SP800-56A Elliptic Curve Diffie-Hellman

– NIST Standard P256 Elliptic Curve Support

• Hardware Support for Symmetric Algorithms:

– SHA-256 & HMAC Hash including off-chip context save/restore

– AES-128: Encrypt/Decrypt, Galois Field Multiply for GCM

• Networking Key Management Support:

– Turnkey PRF/HKDF calculation for TLS 1.2 & 1.3

– Ephemeral key generation and key agreement in SRAM

– Small message encryption with keys entirely protected

• Secure Boot Support:

– Full ECDSA code signature validation, optional stored digest/signature

– Optional communication key disablement prior to secure boot

– Encryption/Authentication for messages to prevent on-board attacks

• Internal High-Quality NIST SP 800-90A/B/C Random Number Generator (RNG)

• Two High-Endurance Monotonic Counters

• Unique 72-Bit Serial Number

• Two Interface Options Available:

– High-Speed Single Wire Interface with One GPIO Pin

– 1 MHz Standard I2C Interface

• 1.8V to 5.5V IO Levels, 2.0V to 5.5V Supply Voltage

• Two Temperature Ranges Available:

– Standard Industrial Temperature Range: -40 to +85℃ ℃

– Extended Industrial Temperature Range: -40 to +100℃ ℃

• <150 nA Sleep Current

• Packaging Options

– 8-pad UDFN, 8-lead SOIC and 3-Lead Contact Package Options

– Die-on-Tape and Reel and WLCSP for Qualified Customers (Contact Microchip Sales)

Applications

• IoT network endpoint key management & exchange

• Encryption for small messages and PII data

• Secure Boot and Protected Download

• Ecosystem Control, Anti-cloning

This is a summary document. A

complete document is available under

NDA. For more information, please

contact your local Microchip sales

office.

Pin Configuration and Pinouts

Table 1. Pin Configuration

Pin Function I2C Interface Function SWI Interface

NC No Connect No Connect

GND Ground Ground

SDA Serial Data Serial Data

SCL Serial Clock Input GPIO

VCC Power Supply Power Supply

Figure 1. Package Types

GND

VCC

SCL

SDA

8-lead SOIC

(Top View)

VCC

SCL

SDA

GND

8-pad UDFN

(Top View)

3-lead Contact

(Top View)

GND

VCC

SDA

Note: The UDFN backside paddle is recommended to be connected to GND.

ATECC608B

Table of Contents

Features......................................................................................................................................................... 1

Applications.................................................................................................................................................... 1

1. Introduction............................................................................................................................................. 4

1.1. Applications.................................................................................................................................. 4

1.2. Device Features........................................................................................................................... 4

1.3. Cryptographic Operation.............................................................................................................. 5

Pin Configuration and Pinouts........................................................................................................................2

2. Electrical Characteristics.........................................................................................................................6

2.1. Absolute Maximum Ratings..........................................................................................................6

2.2. Reliability...................................................................................................................................... 6

2.3. AC Parameters: All I/O Interfaces................................................................................................ 6

2.3.1. AC Parameters: Single-Wire Interface...........................................................................7

2.3.2. AC Parameters: I2C Interface........................................................................................9

2.4. DC Parameters: All I/O Interfaces..............................................................................................10

2.4.1. VIH and VIL Specifications............................................................................................10

3. Compatibility..........................................................................................................................................12

3.1. Microchip ATECC608A...............................................................................................................12

3.2. Microchip ATECC508A...............................................................................................................12

3.3. Microchip ATSHA204A, ATECC108A.........................................................................................13

4. Package Marking Information............................................................................................................... 14

5. Package Drawings................................................................................................................................ 15

5.1. 8-lead SOIC................................................................................................................................15

5.2. 8-pad UDFN............................................................................................................................... 18

5.3. 3 Lead Contact........................................................................................................................... 21

6. Revision History.................................................................................................................................... 23

The Microchip Website.................................................................................................................................24

Product Change Notification Service............................................................................................................24

Customer Support........................................................................................................................................ 24

Product Identification System.......................................................................................................................25

Microchip Devices Code Protection Feature................................................................................................ 26

Legal Notice................................................................................................................................................. 26

Trademarks.................................................................................................................................................. 26

Quality Management System....................................................................................................................... 27

Worldwide Sales and Service.......................................................................................................................28

ATECC608B