Microchip MEC1703 Manual de Usario

Microchip No categorizado MEC1703

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2016-2021 Microchip Technology Inc. DS80000704J-page 1
MEC170x
TABLE 1: SILICON IDENTIFICATION
Part
Number Silicon Identifier Functional
Revision C
Functional
Revision E
Functional
Revision F
MEC1701 Device ID(1) 2Dh 2Dh 2Dh
Revision ID for Silicon Revision( )282h 84h 85h
PIS(3) Version/Revision C1 C2 C2
MEC1703 Device ID(1) 2Eh 2Eh 2Eh
Revision ID for Silicon Revision( )282h 84h 85h
PIS(3) Version/Revision F1 F2 F2
MEC1704 Device ID(1) 33h 33h 33h
Revision ID for Silicon Revision( )282h 84h 85h
PIS(3) Version/Revision C1 C2 C2
MEC1705 Device ID(1) 32h 32h 32h
Revision ID for Silicon Revision( )282h 84h 85h
PIS(3) Version/Revision C1 C2 C2
Note 1: The Device ID is visible as an 8-bit number at Plug and Play Configuration Index 20h.
2: The HW Revision Number is visible as an 8-bit number at Plug and Play Configuration Index 21h.
3: Product Identification System (PIS) is defined in the Product Data Sheet.
TABLE 2: SILICON ISSUE SUMMARY
Module Feature Item
Number Issue Summary
Affected Revisions(1)
C E F
SMB Controller SMB Master 1. SMBus Master Controller violates Bus Idle
Time between STO and STA in Byte mode
only
XXX
Boot ROM Crisis Recov-
ery
2. May enter crisis recovery mode in error X X X
JTAG Pins Pins 3. GPIO145 & GPIO146 input disabled in
SWD mode
XXX
EEPROM Con-
troller
TEST 4. For MEC1703 and MEC1705, Test
Register at address 0x4000_2C1C
needs to be programmed to
0x00060101
XXX
ESPI ESPI 5. MAFS flash transfers should be to/from 4-
byte aligned SRAM buffer starting
addresses
XXX
Note 1: Only those issues indicated in the last column apply to the current silicon revision.
2: Please refer to the description below to know a list of parts that are affected.
MEC170x
Silicon Errata and Data Sheet Clarification
MEC170x
DS80000704J-page 2 2016-2021 Microchip Technology Inc.
Silicon Errata Issues
1. Module: SMBus 2.0 Host Controller
DESCRIPTION
SMBus Master Controller violates Bus Idle Time between STO and STA in Byte mode only. This issue only occurs in a
multi-master environment.
Under firmware control, it is possible to generate a new command on the bus before the Bus Idle time expires, thereby
violating the SMBus Idle time.
END USER IMPLICATIONS
The SMBus Master Controller may generate a START condition too soon. The two consequences of this scenario are
that another master will issue a transaction that will get corrupted, which is handled by the lost arbitration mechanism,
or the MEC170x master will unfairly claim the bus too often.
Work Around
There are two solutions:
a) Use the Network Layer instead of Byte mode. This anomaly does not apply to the SMBus Network Layer
operation.
b) If firmware polls the nBB bit to indicate not busy before asserting the PIN bit and writing the data register,
the SMBus Controller will not violate the Bus Idle time.
2. Module: Crisis Recovery Mode
DESCRIPTION
The Boot ROM turns on the internal pull-up on GPIO045 (PVT_STRAP) pin during initialization, then processes the
eFuse settings and samples the GPIO045 input value. It is supposed to sample the pin after waiting a minimum of 1 ms
to determine if it should abort the standard SPI Flash load process and boot from the Crisis Recovery SPI Flash over
the Private SPI Flash interface. However, the boot code turns on the pull-up, does the eFuse processing and samples
the pin immediately without delay. Depending on the external capacitance, this pin may not have enough time to rise to
a high-level and may be misinterpreted as low and enter crisis recovery mode in error.
ROM API’s ROM API’s 6. Some API’s were removed X X
Boot ROM Boot ROM 7. The Boot ROM may not successfully load
Application Code.
X X
ESPI ESPI 8. Host needs to follow recommendations
while changing the Plug and Play base
address
XXX
VBAT VBAT 9. High IBAT current on coin cell insertion X X X(2)
PCR RESETI# 10. Glitch on RESETI# pin during VTR power
up.
XXX
TABLE 2: SILICON ISSUE SUMMARY (CONTINUED)
Module Feature Item
Number Issue Summary
Affected Revisions(1)
C E F
Note 1: Only those issues indicated in the last column apply to the current silicon revision.
2: Please refer to the description below to know a list of parts that are affected.
2016-2021 Microchip Technology Inc. DS80000704J-page 3
MEC170x
END USER IMPLICATIONS
The device may enter crisis recovery mode in error.
Work Around
Implement external pull-up for normal operation.
3. Module: GPIO145 and GPIO146 Inputs Disabled When JTAG Enabled
DESCRIPTION
GPIO145 and GPIO146 inputs are disabled when JTAG enabled and the JTAG debugger is connected in both 4-wire
JTAG mode and 2-wire SWD mode.
END USER IMPLICATIONS
• Cannot use SMB09 when JTAG is enabled and JTAG debugger is connected if device is configured for 2-wire
SWD test mode.
• Cannot use GPIO145 and GPIO146 inputs when JTAG is enabled and JTAG debugger is connected if device is
configured for 2-wire SWD test mode.
Work Around
None.
4. Module: EEPROM Controller
DESCRIPTION
The test register at address 0x4000_2C1C needs to be written to 0x00060101 by the application code during
initialization before accessing and MEC1705.EEPROM for MEC1703
END USER IMPLICATIONS
• EEPROM access may be impacted.
Work Around
During application initialization, the user needs to write the value of 0x00060101 to EEPROM Controller
TEST register at address 0x4000_2C1C, before accessing EEPROM.
5. Module: ESPI
DESCRIPTION
All MAFS flash transfers must be to/from 4-byte aligned SRAM buffer starting addresses. The low-order 2 bits of the
BUFFER ADDRESS register are reserved and must be written as zeros.
END USER IMPLICATIONS
• Customers are required to start om 4-byte aligned SRAM buffer starting addresses. all MAFS flash transfers to/fr
Work Around
Start MAFS flash transfers to/from 4-byte aligned SRAM buffer starting addresses.
6. Module: ROM API’s
DESCRIPTION
Some APIs have been removed from the Functional Revision E devices.
The “version” API return value can be used to determine the version number of the ROM that corresponds to the func-
tional revision of the device as shown in Table 3 below.

Especificaciones del producto

Marca: Microchip
Categoría: No categorizado
Modelo: MEC1703

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