HP Intel Xeon E5507 Manual de Usario
HP
Procesador
Intel Xeon E5507
Lee a continuación 📖 el manual en español para HP Intel Xeon E5507 (102 páginas) en la categoría Procesador. Esta guía fue útil para 3 personas y fue valorada con 4.5 estrellas en promedio por 2 usuarios
Página 1/102
Reference Number: 321323-002
Intel® Xeon® Processor 5500/5600
Series
Thermal/Mechanical Design Guide
March 2010
2 Thermal/Mechanical Design Guide
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or
life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel® Xeon® processor 5500 series, 5600 series and LGA1366 socket may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,
not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor
numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to
represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not
necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost
Technology performance varies depending on hardware, software and overall system configuration. Check with your PC
manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com.
Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2009, Intel Corporation.
Thermal/Mechanical Design Guide 3
Contents
1 Introduction ..............................................................................................................9
1.1 References ....................................................................................................... 10
1.2 Definition of Terms ............................................................................................ 10
2 LGA1366 Socket ...................................................................................................... 13
2.1 Board Layout .................................................................................................... 15
2.2 Attachment to Motherboard ................................................................................ 16
2.3 Socket Components........................................................................................... 16
2.3.1 Socket Body Housing .............................................................................. 16
2.3.2 Solder Balls ........................................................................................... 16
2.3.3 Contacts ............................................................................................... 17
2.3.4 Pick and Place Cover............................................................................... 17
2.4 Package Installation / Removal ........................................................................... 18
2.4.1 Socket Standoffs and Package Seating Plane.............................................. 18
2.5 Durability ......................................................................................................... 19
2.6 Markings .......................................................................................................... 19
2.7 Component Insertion Forces ............................................................................... 19
2.8 Socket Size ...................................................................................................... 19
2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 20
3 Independent Loading Mechanism (ILM)................................................................... 21
3.1 Design Concept................................................................................................. 21
3.1.1 ILM Cover Assembly Design Overview ....................................................... 21
3.1.2 ILM Back Plate Design Overview............................................................... 22
3.2 Assembly of ILM to a Motherboard....................................................................... 23
4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 27
4.1 Component Mass............................................................................................... 27
4.2 Package/Socket Stackup Height .......................................................................... 27
4.3 Socket Maximum Temperature............................................................................27
4.4 Loading Specifications........................................................................................ 28
4.5 Electrical Requirements...................................................................................... 28
4.6 Environmental Requirements .............................................................................. 29
5 Thermal Solutions ................................................................................................... 31
5.1 Performance Targets.......................................................................................... 31
5.1.1 25.5 mm Tall Heatsink ............................................................................ 32
5.2 Heat Pipe Considerations.................................................................................... 33
5.3 Assembly ......................................................................................................... 34
5.3.1 Thermal Interface Material (TIM) .............................................................. 35
5.4 Structural Considerations ................................................................................... 35
5.5 Thermal Design................................................................................................. 35
5.5.1 Thermal Characterization Parameter .........................................................35
5.5.2 Dual Thermal Profile ............................................................................... 36
5.6 Thermal Features .............................................................................................. 37
5.6.1 Fan Speed Control.................................................................................. 37
5.6.2 PECI Averaging and Catastrophic Thermal Management............................... 38
5.6.3 Intel® Turbo Boost Technology ................................................................ 39
5.7 Thermal Guidance ............................................................................................. 39
5.7.1 Thermal Excursion Power for Processors with Dual Thermal Profile ................ 39
5.7.2 Thermal Excursion Power for Processors with Single Thermal Profile.............. 40
5.7.3 Absolute Processor Temperature .............................................................. 40
6 Quality and Reliability Requirements ....................................................................... 41
6.1 Test Conditions ................................................................................................. 41
Especificaciones del producto
| Marca: | HP |
| Categoría: | Procesador |
| Modelo: | Intel Xeon E5507 |
¿Necesitas ayuda?
Si necesitas ayuda con HP Intel Xeon E5507 haz una pregunta a continuación y otros usuarios te responderán
Procesador HP Manuales
24 Agosto 2024
27 Julio 2024
11 Julio 2024
Procesador Manuales
- Procesador Yamaha
- Procesador Alpine
- Procesador Arturia
- Procesador Hikvision
- Procesador Black And Decker
- Procesador Lenovo
- Procesador Toa
- Procesador Roland
- Procesador Summit Audio
- Procesador LD Systems
- Procesador Bogen
- Procesador Matrox
- Procesador Allen & Heath
- Procesador Bose
- Procesador Fujitsu
- Procesador Rupert Neve Designs
- Procesador Shure
- Procesador Intel
- Procesador Chandler
- Procesador Zoom
- Procesador Eventide
- Procesador Radial Engineering
- Procesador RGBlink
- Procesador Gefen
- Procesador DBX
- Procesador Solid State Logic
- Procesador Mathew Lane
- Procesador SPL
- Procesador Lindell Audio
- Procesador Drawmer
- Procesador Smart-AVI
- Procesador SIIG
- Procesador Sonifex
- Procesador Manley
- Procesador KanexPro
- Procesador Ashly
- Procesador Dangerous Music
- Procesador Helix
- Procesador TC Helicon
- Procesador Christie
- Procesador Atlas Sound
- Procesador Rane
- Procesador Neutrik
- Procesador AMD
- Procesador Lexicon
- Procesador Empirical Labs
- Procesador CEDAR
- Procesador Lectrosonics
- Procesador Vivolink
- Procesador AudioThing
- Procesador Avenview
- Procesador Phoenix Gold
- Procesador BSS Audio
- Procesador AMX
- Procesador BZBGear
- Procesador Heritage Audio
- Procesador MuxLab
- Procesador FabFilter
- Procesador Metric Halo
- Procesador SEADA
- Procesador Datapath
- Procesador Henry Engineering
- Procesador MyMix
Últimos Procesador Manuales
21 Octubre 2024
1 Octubre 2024
27 Septiembre 2024
21 Septiembre 2024
18 Septiembre 2024
18 Septiembre 2024
18 Septiembre 2024
18 Septiembre 2024
18 Septiembre 2024
18 Septiembre 2024