Texas Instruments SN74CB3Q3257PWR Manual de Usario

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1B11A
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74CB3Q3257
SCDS135D – SEPTEMBER 2003 – REVISED JULY 2018
SN74CB3Q3257 4-Bit 1-of-2 FET Multiplexer/Demultiplexer
2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch
1
(1) For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application
report, ,CBT-C, CB3T, and CB3Q Signal-Switch Families
SCDA008.
1 Features
1
High-Bandwidth Data Path
(up to 500 MHz)
5-V Tolerant I/Os With Device Powered Up or
Powered Down
Low and Flat ON-State Resistance (ron)
Characteristics Over Operating Range
(ron= 4 Typical)
Rail-to-Rail Switching on Data I/O Ports
0- to 5-V Switching With 3.3-V VCC
0- to 3.3-V Switching With 2.5-V VCC
Bidirectional Data Flow With Near-Zero
Propagation Delay
Low Input and Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 3.5 pF Typical)
Fast Switching Frequency (f OE = 20 MHz
Maximum)
Data and Control Inputs Provide Undershoot
Clamp Diodes
Low Power Consumption
(ICC = 0.7 mA Typical)
• VCC Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
• IoSupports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
2000-V Human Body Model
(A114-B, Class II)
1000-V Charged-Device Model (C101)
Supports Both Digital and Analog Applications:
USB Interface, Dierential Signal Interface,
Bus Isolation, Low-Distortion Signal Gating (1)
2 Applications
IP Phones: Wired and Wireless
Optical Modules
Optical Networking: Video Over Fiber and EPON
Private Branch Exchange (PBX)
WiMAX and Wireless Infrastructure Equipment
3 Description
The SN74CB3Q3257 device is a high-bandwidth FET
bus switch utilizing a charge pump to elevate the gate
voltage of the pass transistor, providing a low and at
ON-state resistance (ron).
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SN74CB3Q3257DGV TVSOP (16) 3.60 mm × 4.40 mm
SN74CB3Q3257DBQ SSOP (16) 4.90 mm × 3.90 mm
SN74CB3Q3257PW TSSOP (16) 5.00 mm × 4.40 mm
SN74CB3Q3257RGY VQFN (16) 4.00 mm × 3.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
2
SN74CB3Q3257
SCDS135D – SEPTEMBER 2003 – REVISED JULY 2018
www.ti.com
Product Folder Links: SN74CB3Q3257
Submit Documentation Feedback Copyright © 2003–2018, Texas Instruments Incorporated
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Conguration and Functions ......................... 3
6 Specications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics .......................................... 5
6.6 Switching Characteristics, VCC = 2.5 V ..................... 6
6.7 Switching Characteristics, VCC = 3.3 V ..................... 6
6.8 Typical Characteristics.............................................. 6
7 Parameter Measurement Information .................. 7
8 Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
8.4 Device Functional Modes.......................................... 9
9 Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Application ................................................. 10
10 Power Supply Recommendations ..................... 11
11 Layout................................................................... 11
11.1 Layout Guidelines ................................................. 11
11.2 Layout Example .................................................... 11
12 Device and Documentation Support ................. 12
12.1 Documentation Support ........................................ 12
12.2 Receiving Notication of Documentation Updates 12
12.3 Community Resources.......................................... 12
12.4 Trademarks ........................................................... 12
12.5 Electrostatic Discharge Caution............................ 12
12.6 Glossary ................................................................ 12
13 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
Changes from Revision C (April 2017) to Revision D Page
Changed the pinout images appearance .............................................................................................................................. 3
Added table values ...............................................................................................................................Thermal Information 5
Changes from Revision B (June 2015) to Revision C Page
Added MAX values for TA= –40°C to 105°C to the table..............................................................Electrical Characteristics 5
Added MAX values for TA= –40°C to 105°C to the Switching Characteristics, V
CC = 2.5 V table. ...................................... 6
Added separate Switching Characteristics, VCC = 3.3 V for VCC = 3.3 V ± 0.3 V. Added TYP values and MAX values
for TA= –40°C to 105°C ......................................................................................................................................................... 6
Changes from Revision A (November 2003) to Revision B Page
Removed table. ....................................................................................................................................Ordering Information 1
• Added table, section, table,Device Information Pin Conguration and Functions ESD Ratings Feature Description
section, , section,Device Functional Modes Application and Implementation Power Supply Recommendations
section, section, section, andLayout Device and Documentation Support Mechanical, Packaging, and Orderable
Information section ................................................................................................................................................................ 1
Thermal
Pad
21B1
31B2
41A
52B1
62B2
72A
8GND
93A
10 3B2
11 3B1
12 4A
13 4B2
14 4B1
15 OE
16 VCC
1 S
Not to scale
3
SN74CB3Q3257
www.ti.com
SCDS135D – SEPTEMBER 2003 – REVISED JULY 2018
Product Folder Links: SN74CB3Q3257
Submit Documentation FeedbackCopyright © 2003–2018, Texas Instruments Incorporated
5 Pin Conguration and Functions
D, DB, DGV, DBQ, or PW Package
16-Pin SOIC, SSOP TVSOP, or TSSOP
Top View
RGY Package
16-Pin VQFN
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
S 1 I Select Pin
1B1 2 I/O Channel 1 I/O 1
1B2 3 I/O Channel 1 I/O 2
1A 4 I/O Channel 1 common
2B1 5 I/O Channel 2 I/O 1
2B2 6 I/O Channel 2 I/O 2
2A 7 I/O Channel 2 common
GND 8 — Ground
3A 9 I/O Channel 3 common
3B2 10 I/O Channel 3 I/O 2
3B1 11 I/O Channel 3 I/O 1
4A 12 I/O Channel 4 common
4B2 13 I/O Channel 4 I/O 2
4B1 14 I/O Channel 4 I/O 1
OE 15 I Output Enable (Active Low)
VCC 16 — Power

Especificaciones del producto

Marca: Texas Instruments
Categoría: No categorizado
Modelo: SN74CB3Q3257PWR

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